Samsung to Adopt Rival's Chip Tech to Boost AI Memory Production
• Samsung plans to use a chipmaking technology called mass reflow molded underfill (MR-MUF) favored by rival SK Hynix to boost production and yields of high bandwidth memory (HBM) chips for AI
• Samsung has fallen behind rivals in supplying latest HBM chips to AI leader Nvidia due to using an older technology called non-conductive film (NCF)
• Sources say Samsung's HBM3 chip yields are only 10-20% versus 60-70% for SK Hynix using MUF technique
• Samsung is in talks with materials makers like Japan's Nagase to source MUF materials, but mass production with MUF unlikely before 2023
• The move shows pressure Samsung faces in the AI chip race, with its stock lagging rivals SK Hynix and Micron amid booming HBM market