Intel Develops New Glass Substrate to Power Next-Gen Chips, Help Close Gap with Rivals

Intel is developing new glass substrate technology to be a foundation for next-generation processors. The glass provides more speed, power efficiency, and space for transistors compared to current organic substrates.
Intel has already built a functioning manufacturing line for the glass substrates at its factory in Chandler, Arizona. The technology is expected to be mature later this decade.
The glass will enable a new generation of more powerful server and data center processors. As costs come down, it could also be used in consumer laptops and PCs.
The glass substrates help Intel implement its "five nodes in four years" plan to catch up and surpass rivals like TSMC in manufacturing. Intel has completed two out of five so far.
Advanced packaging, like Intel's EMIB and Foveros, will allow multiple chiplets to be combined into larger, more powerful processors. The glass provides the interconnects and power delivery for this modular approach.

Intel is developing new glass substrate technology to be a foundation for next-generation processors. The glass provides more speed, power efficiency, and space for transistors compared to current organic substrates.
Intel has already built a functioning manufacturing line for the glass substrates at its factory in Chandler, Arizona. The technology is expected to be mature later this decade.
The glass will enable a new generation of more powerful server and data center processors. As costs come down, it could also be used in consumer laptops and PCs.
The glass substrates help Intel implement its "five nodes in four years" plan to catch up and surpass rivals like TSMC in manufacturing. Intel has completed two out of five so far.
Advanced packaging, like Intel's EMIB and Foveros, will allow multiple chiplets to be combined into larger, more powerful processors. The glass provides the interconnects and power delivery for this modular approach.