Intel Shifts to Glass Substrates for Faster, More Powerful Chips by End of Decade

Intel is moving to glass substrates instead of organic resin to connect processors' power and data pathways. This will enable faster, more powerful chips by the end of the decade.
The glass allows more connections, doesn't warp as much, wastes less power, and can operate at higher temps than organic resin.
Glass substrates will first be used in high-end server chips in data centers, then spread to consumer laptops.
This is part of Intel's multi-year effort to catch up to rivals TSMC and Samsung in chip manufacturing using new "chiplets" packaging.
Intel has developed the glass technology over a decade and already has a functioning manufacturing line for it in Arizona.

cnet.com

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9/18/2023

Intel Unveils New Glass Substrate to Enable Scaling for AI Chips

Intel has unveiled a new glass substrate material that will allow for the "continued scaling" of transistors and push Moore's Law for data-centric applications, such as artificial intelligence, by enabling higher interconnect density and better thermal stability.