Intel Unveils New Glass Substrate to Enable Scaling for AI Chips

Intel unveiled a new glass substrate material for advanced packaging to enable continued scaling of transistors and push Moore's Law for data-centric apps like AI.
The glass substrate allows for more flatness and better thermal stability, resulting in higher interconnect density.
This will allow for creation of higher density and higher performance chip packages, important for power-hungry AI workloads.
Intel aims to deliver the new glass substrates to market in the second half of the decade and keep pushing Moore's Law beyond 2030.
Intel stock fell about 0.7% in pre-market trading on the news.

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9/19/2023

Intel Shifts to Glass Substrates for Faster, More Powerful Chips by End of Decade

Intel is developing glass substrate technology to replace epoxy-like organic resin as a foundation for its processors, offering faster speeds, more power, and increased real estate for chip industry advancements, with the technology expected to be mature later in the decade.