The Pixel 8 series is expected to bring significant improvements, such as an upgraded Tensor chip, a flat glass panel display, longer software update lifespan, and a new camera sensor, while still being relatively cheaper compared to its competition.
Google Tensor's upcoming third-generation chip, Tensor G3, is rumored to adopt a new packaging method called FO-WLP to improve thermal performance and overall efficiency.
Google's plans for its future Tensor chips include a fully custom SoC codenamed "Redondo" for the 2025 Pixel series, as well as a smaller upgrade chip called "Zuma Pro" for the Pixel 9, but both chips will still be co-designed with Samsung's System LSI division.
Modest design changes and improved performance are expected for the Google Pixel 8 and Pixel 8 Pro, including display tweaks, camera upgrades, and a "next-generation" Tensor G3 chip, with a rumored release date of October 11 and prices starting at $649.
Google is set to launch the Pixel 8 Pro smartphone, featuring its own Tensor chipset for enhanced AI and machine learning capabilities and offering a seven-year support window for Android OS updates and security fixes.
The leaked retail information about the Pixel 8 Pro also revealed key specifications of the Tensor G3, including a 1+4+4 CPU layout, a 4nm process, and a Cortex-X3 flagship core.
Google's upcoming Pixel 8 Pro flagship phone, powered by the Tensor G3 chipset, has underwhelming benchmark scores compared to its competitors, but still shows a 20% improvement from last year's model.
抢占AI领域，Google发布Pixel 8和Pixel 8 Pro，搭载Tensor G3 SoC芯片。新功能包括增强的骚扰电话筛选功能，提升音频和视频质量，以及"音频神奇橡皮擦"功能。Tensor G3采用9核心CPU，支持Magic Eraser功能，同时内置12GB的RAM和Mali-G715 GPU。采用三星新款4纳米工艺，性能更高效。
The main topic of the content is the new features and specifications of Google's Pixel 8 smartphone.
The key points are:
1. Smaller display size but with the same 1,080 x 2,400 resolution and improved OLED technology for better brightness and color.
2. Larger battery and fast charging capabilities for improved battery life.
3. Upgraded rear camera with advanced features and improved camera software powered by the new Tensor G3 chip.
The Pixel 8 Pro has undergone a teardown, revealing concerns about its ability to manage heat and the absence of a vapor chamber cooling system, relying instead on graphite and copper. Additionally, questions arise about the performance, efficiency, and stability of the Tensor G3 SoC. Despite these concerns, the device offers impressive camera samples and AI features.
Google's upcoming Pixel 8a will have a design similar to the flagship Pixel 8 series, with rounded edges and a pill-shaped camera cutout on the rear, although it is unlikely to have a high refresh rate panel like the Pixel 8 and may have chunky bezels, and it is expected to use the same Tensor G3 SoC as the Pixel 8 with possibly a lower clock speed and 7 years of software support.
