Google's New Tensor G3 Chip for Pixel 8 May Improve Performance and Battery Life with Advanced Packaging

Google Tensor G3 chip for Pixel 8 may adopt new FO-WLP packaging to prevent overheating
Current Tensor chips have faced issues like poor battery life and easy overheating
FO-WLP packaging can create a smaller footprint and improve thermal performance
Tensor G3 expected to have new core layout and upgraded Samsung manufacturing process
Pixel 8 with Tensor G3 set to be fully unveiled by Google on October 4

9to5google.com

Relevant topic timeline:

9/12/2023

Google's Tensor G3 Chip May Run Cooler With New Packaging Tech

The upcoming Tensor G3 chip from Google's Pixel 8 series is expected to incorporate new packaging technology, which could potentially address the overheating issues experienced with previous Tensor chips.

9/17/2023

Google's 2024 Tensor Chip Will See Modest Upgrades Before Fully Custom SoC in 2025

Google's upcoming Tensor G4 chip, expected to launch in 2025, will not be as impressive as previously predicted, as it will still be an Exynos derivative and build upon its predecessor, the Tensor G3. Google plans to eventually build its own IP library to design a fully custom chip by 2025.