Chip Packaging Shortage to Limit Supply of Top AI Chips Until Late 2024
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TSMC warns shortage of advanced chip packaging capacity will continue impacting supply of top AI accelerators like Nvidia's A100 and H100 until late 2024.
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Problem is not lack of chip production but constrained advanced CoWoS packaging used to assemble components.
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Shortage affects accelerators like Nvidia's H100 and AMD's upcoming Instinct MI300-series that rely heavily on CoWoS.
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TSMC expanding packaging capacity but it will take 18 months to resolve shortage.
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While TSMC uses CoWoS, competitors like Samsung and Intel have alternate advanced packaging technologies.